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MEMS packaging
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MEMS packaging

书目详细资料
其他作者: Lee, Yung-Cheng (Editor), Cheng, Yu-Ting (Editor), Ramadoss, Ramesh (Editor)
格式: Electronic Resource
语言:English
出版: New Jersey World Scientific [2018]
丛编:WSPC series in advanced integration and packaging volume 5
主题:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
在线阅读:Available for University of the Philippines Diliman via World Scientific. Click here to access
Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
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