MEMS packaging

Bibliographic Details
Other Authors:	Lee, Yung-Cheng (Editor), Cheng, Yu-Ting (Editor), Ramadoss, Ramesh (Editor)
Format:	Electronic Resource
Language:	English
Published:	New Jersey World Scientific [2018]
Series:	WSPC series in advanced integration and packaging volume 5
Subjects:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online Access:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy