MEMS packaging

書誌詳細
その他の著者:	Lee, Yung-Cheng (編集者), Cheng, Yu-Ting (編集者), Ramadoss, Ramesh (編集者)
フォーマット:	Electronic Resource
言語:	English
出版事項:	New Jersey World Scientific [2018]
シリーズ:	WSPC series in advanced integration and packaging volume 5
主題:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
オンライン･アクセス:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy