MEMS packaging

Bibliografiska uppgifter
Övriga upphovsmän:	Lee, Yung-Cheng (Utgivare, redaktör, sammanställare), Cheng, Yu-Ting (Utgivare, redaktör, sammanställare), Ramadoss, Ramesh (Utgivare, redaktör, sammanställare)
Materialtyp:	Electronic Resource
Språk:	English
Publicerad:	New Jersey World Scientific [2018]
Serie:	WSPC series in advanced integration and packaging volume 5
Ämnen:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Länkar:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy