MEMS packaging

Bibliografische gegevens
Andere auteurs:	Lee, Yung-Cheng (Redacteur), Cheng, Yu-Ting (Redacteur), Ramadoss, Ramesh (Redacteur)
Formaat:	Electronic Resource
Taal:	English
Gepubliceerd in:	New Jersey World Scientific [2018]
Reeks:	WSPC series in advanced integration and packaging volume 5
Onderwerpen:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online toegang:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy