MEMS packaging
| अन्य लेखक: | , , |
|---|---|
| स्वरूप: | Electronic Resource |
| भाषा: | English |
| प्रकाशित: |
New Jersey
World Scientific
[2018]
|
| श्रृंखला: | WSPC series in advanced integration and packaging
volume 5 |
| विषय: | |
| ऑनलाइन पहुंच: | Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy |