MEMS packaging

Détails bibliographiques
Autres auteurs:	Lee, Yung-Cheng (Éditeur intellectuel), Cheng, Yu-Ting (Éditeur intellectuel), Ramadoss, Ramesh (Éditeur intellectuel)
Format:	Electronic Resource
Langue:	English
Publié:	New Jersey World Scientific [2018]
Collection:	WSPC series in advanced integration and packaging volume 5
Sujets:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Accès en ligne:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy