MEMS packaging

Detalles Bibliográficos
Otros Autores:	Lee, Yung-Cheng (Editor), Cheng, Yu-Ting (Editor), Ramadoss, Ramesh (Editor)
Formato:	Electronic Resource
Lenguaje:	English
Publicado:	New Jersey World Scientific [2018]
Colección:	WSPC series in advanced integration and packaging volume 5
Materias:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Acceso en línea:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy