MEMS packaging

Bibliografiske detaljer
Andre forfattere:	Lee, Yung-Cheng (Editor), Cheng, Yu-Ting (Editor), Ramadoss, Ramesh (Editor)
Format:	Electronic Resource
Sprog:	English
Udgivet:	New Jersey World Scientific [2018]
Serier:	WSPC series in advanced integration and packaging volume 5
Fag:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online adgang:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy