MEMS packaging

Podrobná bibliografie
Další autoři:	Lee, Yung-Cheng (Editor), Cheng, Yu-Ting (Editor), Ramadoss, Ramesh (Editor)
Médium:	Electronic Resource
Jazyk:	English
Vydáno:	New Jersey World Scientific [2018]
Edice:	WSPC series in advanced integration and packaging volume 5
Témata:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
On-line přístup:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy