MEMS packaging

Bibliographische Detailangaben
Weitere Verfasser:	Lee, Yung-Cheng (HerausgeberIn), Cheng, Yu-Ting (HerausgeberIn), Ramadoss, Ramesh (HerausgeberIn)
Format:	Electronic Resource
Sprache:	English
Veröffentlicht:	New Jersey World Scientific [2018]
Schriftenreihe:	WSPC series in advanced integration and packaging volume 5
Schlagworte:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online Zugang:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy