MEMS packaging

מידע ביבליוגרפי
מחברים אחרים:	Lee, Yung-Cheng (Editor), Cheng, Yu-Ting (Editor), Ramadoss, Ramesh (Editor)
פורמט:	Electronic Resource
שפה:	English
יצא לאור:	New Jersey World Scientific [2018]
סדרה:	WSPC series in advanced integration and packaging volume 5
נושאים:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
גישה מקוונת:	Available for University of the Philippines Diliman via World Scientific. Click here to access Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy