Lee, Y., Cheng, Y., & Ramadoss, R. (2018). MEMS packaging. World Scientific.
Chicago Style aipamenaLee, Yung-Cheng, Yu-Ting Cheng, and Ramesh Ramadoss. MEMS Packaging. New Jersey: World Scientific, 2018.
MLA aipamenaLee, Yung-Cheng, et al. MEMS Packaging. World Scientific, 2018.
Kontuz: berrikusi erreferentzia hauek erabili aurretik.