Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method

Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method

Dades bibliogràfiques
Autor principal: Seok, Seonho (Autor)
Autor corporatiu: SpringerLink (Online service)
Format: Electronic Resource
Idioma:English
Publicat: Cham Springer International Publishing [2018]
Col·lecció:Springer Series in Advanced Manufacturing
Matèries:
Engineering.
Nanotechnology.
Manufacturing industries.
Machines.
Tools.
Tribology.
Corrosion and anti-corrosives.
Coatings.
Materials science.
Electronic books.
Accés en línia:Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy