Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method
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Format: | Electronic Resource |
Sprache: | English |
Veröffentlicht: |
Cham
Springer International Publishing
[2018]
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Schriftenreihe: | Springer Series in Advanced Manufacturing
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Online Zugang: | Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy |