Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method

Bibliographische Detailangaben
1. Verfasser: Seok, Seonho (VerfasserIn)
Körperschaft: SpringerLink (Online service)
Format: Electronic Resource
Sprache:English
Veröffentlicht: Cham Springer International Publishing [2018]
Schriftenreihe:Springer Series in Advanced Manufacturing
Schlagworte:
Online Zugang:Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy