APA (7th ed.) Citation

Seok, S. (2018). Advanced packaging and manufacturing technology based on adhesion engineering: Wafer-level transfer packaging and fabrication techniques using interface energy control method. Springer International Publishing. https://doi.org/10.1007/978-3-319-77872-3

Chicago Style (17th ed.) Citation

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Cham: Springer International Publishing, 2018. https://doi.org/10.1007/978-3-319-77872-3.

MLA (9th ed.) Citation

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer International Publishing, 2018. https://doi.org/10.1007/978-3-319-77872-3.