Through-silicon vias for 3D integration
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | Electronic Resource |
| भाषा: | English |
| प्रकाशित: |
New York
McGraw-Hill Education
[2013]
|
| संस्करण: | First edition. |
| विषय: | |
| ऑनलाइन पहुंच: | Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy |