3D microelectronic packaging from fundamentals to applications
| Байгууллагын зохиогч: | |
|---|---|
| Бусад зохиолчид: | , |
| Формат: | Electronic Resource |
| Хэл сонгох: | англи |
| Хэвлэсэн: |
Cham
Springer
[2017]
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| Нөхцлүүд: | |
| Онлайн хандалт: | Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy |