Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

Chi tiết về thư mục
Tác giả chính: Zhang, Qingke (Tác giả)
Tác giả của công ty: SpringerLink (Online service)
Định dạng: Electronic Resource
Ngôn ngữ:English
Được phát hành: Berlin Springer [2016]
Những chủ đề:
Lead-free electronics manufacturing processes > Research.
Solder and soldering > Design and construction.
Electronics > Materials.
Electronic books.
Truy cập trực tuyến:Available for University of the Philippines System via SpringerLink. Click here to access
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