Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Zhang, Qingke (مؤلف)
مؤلف مشترك:	SpringerLink (Online service)
التنسيق:	Electronic Resource
اللغة:	English
منشور في:	Berlin Springer [2016]
الموضوعات:	Lead-free electronics manufacturing processes > Research. Solder and soldering > Design and construction. Electronics > Materials. Electronic books.
الوصول للمادة أونلاين:	Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy