Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

Sonraí bibleagrafaíochta
Príomhchruthaitheoir: Zhang, Qingke (Údar)
Údar corparáideach: SpringerLink (Online service)
Formáid: Electronic Resource
Teanga:English
Foilsithe / Cruthaithe: Berlin Springer [2016]
Ábhair:
Rochtain ar líne:Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy