Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

Sonraí bibleagrafaíochta
Príomhchruthaitheoir:	Zhang, Qingke (Údar)
Údar corparáideach:	SpringerLink (Online service)
Formáid:	Electronic Resource
Teanga:	English
Foilsithe / Cruthaithe:	Berlin Springer [2016]
Ábhair:	Lead-free electronics manufacturing processes > Research. Solder and soldering > Design and construction. Electronics > Materials. Electronic books.
Rochtain ar líne:	Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy