Electrochemical migration of silver in electronics applications
Silver (Ag) filler is the most attractive choice among all the conductive fillers. However, silver electrochemically migrates in the presence of moisture and applied bias. In microelectronic devices, silver migration usually occurs between adjacent conductors/electrodes, which leads to the formation...
| 發表在: | Philippine Engineering Journal 37, 2 (2016(D)). |
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| 格式: | Article |
| 語言: | English |
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| 在線閱讀: | Also available online for University of the Philippines Diliman. Click here |