Defect-mediated runaway oxidation of electroplated tin
Pure tin is widely used as a replacement of Pb-Sn eutectic alloy as finish and solder material. The normal oxide film is thin, passivating, and grows logarithmically with time. The tendency to form an undesired thick oxide layer under high temperature conditions is documented, but poorly understood....
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| フォーマット: | 学位論文 |
| 言語: | English |
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