Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Opis bibliograficzny
Wydane w:Industrial engineering & management systems 2, 2 (2003 (D)).
1. autor: Tien-Lung Sun
Kolejni autorzy: Chih-Cheng Tsai
Format: Artykuł
Język:English
Hasła przedmiotowe:
IC manufacturing.
Data mining tree.
Data visualization.
Parallel coordinates.
Decision tree.