Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Dades bibliogràfiques
Publicat a:Industrial engineering & management systems 2, 2 (2003 (D)).
Autor principal: Tien-Lung Sun
Altres autors: Chih-Cheng Tsai
Format: Article
Idioma:English
Matèries:
IC manufacturing.
Data mining tree.
Data visualization.
Parallel coordinates.
Decision tree.