Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Dettagli Bibliografici
Pubblicato in:Industrial engineering & management systems 2, 2 (2003 (D)).
Autore principale: Tien-Lung Sun
Altri autori: Chih-Cheng Tsai
Natura: Articolo
Lingua:English
Soggetti:
IC manufacturing.
Data mining tree.
Data visualization.
Parallel coordinates.
Decision tree.