APA (7. basım) Alıntı

Tien-Lung Sun & Chih-Cheng Tsai. Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique. Industrial engineering & management systems.

Chicago Style (17. basım) Atıf

Tien-Lung Sun ve Chih-Cheng Tsai. "Analysis of LPC Data for Wafer Yield Improvement Using a Combined Data Mining and Visualization Technique." Industrial Engineering & Management Systems .

MLA (9th ed.) Atıf

Tien-Lung Sun ve Chih-Cheng Tsai. "Analysis of LPC Data for Wafer Yield Improvement Using a Combined Data Mining and Visualization Technique." Industrial Engineering & Management Systems, .