Tien-Lung Sun & Chih-Cheng Tsai. Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique. Industrial engineering & management systems.
Chicago Style (17th ed.) CitationTien-Lung Sun and Chih-Cheng Tsai. "Analysis of LPC Data for Wafer Yield Improvement Using a Combined Data Mining and Visualization Technique." Industrial Engineering & Management Systems .
MLA (9th ed.) CitationTien-Lung Sun and Chih-Cheng Tsai. "Analysis of LPC Data for Wafer Yield Improvement Using a Combined Data Mining and Visualization Technique." Industrial Engineering & Management Systems, .
Warning: These citations may not always be 100% accurate.