Tien-Lung Sun & Chih-Cheng Tsai. Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique. Industrial engineering & management systems.
Citação do estilo Chicago (17ª ed.)Tien-Lung Sun e Chih-Cheng Tsai. "Analysis of LPC Data for Wafer Yield Improvement Using a Combined Data Mining and Visualization Technique." Industrial Engineering & Management Systems .
Citação MLA (9ª ed.)Tien-Lung Sun e Chih-Cheng Tsai. "Analysis of LPC Data for Wafer Yield Improvement Using a Combined Data Mining and Visualization Technique." Industrial Engineering & Management Systems, .
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