Fundamentals of lead-free solder interconnect technology from microstructures to reliability

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής

Κύριοι συγγραφείς:	Lee, Tae-Kyu (Συγγραφέας), Bieler, Thomas R. (Συγγραφέας), Kim, Choong-Un (Συγγραφέας), Ma, Hongtao (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή:	SpringerLink (Online service)
Μορφή:	Electronic Resource
Γλώσσα:	English
Έκδοση:	Boston, MA Springer US [2015]
Θέματα:	Solder and soldering. Lead-free electronics manufacturing processes. Electronic books.
Διαθέσιμο Online:	Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy