Fundamentals of lead-free solder interconnect technology from microstructures to reliability

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Detalhes bibliográficos
Main Authors: Lee, Tae-Kyu (Author), Bieler, Thomas R. (Author), Kim, Choong-Un (Author), Ma, Hongtao (Author)
Autor Corporativo: SpringerLink (Online service)
Formato: Electronic Resource
Idioma:English
Publicado em: Boston, MA Springer US [2015]
Assuntos:
Acesso em linha:Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy