Fundamentals of lead-free solder interconnect technology from microstructures to reliability
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...
| Main Authors: | , , , |
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| Autor Corporativo: | |
| Formato: | Electronic Resource |
| Idioma: | English |
| Publicado em: |
Boston, MA
Springer US
[2015]
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| Assuntos: | |
| Acesso em linha: | Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy |


