Fundamentals of lead-free solder interconnect technology from microstructures to reliability

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Autors principals:	Lee, Tae-Kyu (Autor), Bieler, Thomas R. (Autor), Kim, Choong-Un (Autor), Ma, Hongtao (Autor)
Autor corporatiu:	SpringerLink (Online service)
Format:	Electronic Resource
Idioma:	English
Publicat:	Boston, MA Springer US [2015]
Matèries:	Solder and soldering. Lead-free electronics manufacturing processes. Electronic books.
Accés en línia:	Available for University of the Philippines System via SpringerLink. Click here to access Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy