APA (7e ed.) Bronvermelding

Lee, T., Bieler, T. R., Kim, C., & Ma, H. (2015). Fundamentals of lead-free solder interconnect technology: From microstructures to reliability. Springer US. https://doi.org/10.1007/978-1-4614-9266-5

Chicago (17e ed.) Bronvermelding

Lee, Tae-Kyu, Thomas R. Bieler, Choong-Un Kim, en Hongtao Ma. Fundamentals of Lead-free Solder Interconnect Technology: From Microstructures to Reliability. Boston, MA: Springer US, 2015. https://doi.org/10.1007/978-1-4614-9266-5.

MLA (9e ed.) Bronvermelding

Lee, Tae-Kyu, et al. Fundamentals of Lead-free Solder Interconnect Technology: From Microstructures to Reliability. Springer US, 2015. https://doi.org/10.1007/978-1-4614-9266-5.