Silicon wafer bonding technology for VLSI and MEMS applications

Silicon wafer bonding technology for VLSI and MEMS applications

Detaylı Bibliyografya
Müşterek Yazar: INSPEC. EMIS Group
Diğer Yazarlar: Iyer, Subramanian S. (Editör), Auberton-Herve, Andre J. (Editör)
Materyal Türü: Electronic Resource
Dil:English
Baskı/Yayın Bilgisi: London, United Kingdom Institution of Engineering and Technology 2002.
Konular:
Silicon-on-insulator technology.
Integrated circuits > Very large scale integration.
Microelectromechanical systems.
Electronic books.
Online Erişim:Available for University of the Philippines Diliman via IET Digital Library. Click here to access
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