INSPEC. EMIS Group, Iyer, S. S., & Auberton-Herve, A. J. (2002). Silicon wafer bonding technology: For VLSI and MEMS applications. Institution of Engineering and Technology. https://doi.org/10.1049/PBEP001E
Chicago Style (17th ed.) CitationINSPEC. EMIS Group, Subramanian S. Iyer, and Andre J. Auberton-Herve. Silicon Wafer Bonding Technology: For VLSI and MEMS Applications. London, United Kingdom: Institution of Engineering and Technology, 2002. https://doi.org/10.1049/PBEP001E.
MLA (9th ed.) CitationINSPEC. EMIS Group, et al. Silicon Wafer Bonding Technology: For VLSI and MEMS Applications. Institution of Engineering and Technology, 2002. https://doi.org/10.1049/PBEP001E.
Warning: These citations may not always be 100% accurate.