Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method

Investigation of the effect of varying silicon die size and thickness on a small outline transistor on the silicon die crack using finite element method

The current trend for electronic products, especially those in the telecommunications, is to be more compact. To match the demand for compact products, a size reduction of electronic product components such as the small outline diodes (SOD) and small outline transistor (SOT) is therefore needed. Thi...

Disgrifiad llawn

Manylion Llyfryddiaeth
Prif Awdur: Ducusin, Hannah Erika R. (Awdur)
Awduron Eraill: Dimagiba, Richard Raymond N. (adviser.), Mena, Manolo G. (adviser.)
Fformat: Traethawd Ymchwil
Iaith:English
Pynciau:
Transistors.