Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics
In today's microelectronic industry, the increasing demand for miniaturization and high functions integration poses a big challenge in maintaining the reliability of the package. Several studies were conducted to address these challenges. It was found out that majority of the reliability proble...
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| Άλλοι συγγραφείς: | , |
| Μορφή: | Thesis |
| Γλώσσα: | English |
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