Intermetallic formation of nickel-palladium kovar lids on ceramic microelectronic packages
Palladium (Pd) was added in between the nickel (Ni) and gold (Au) flash layer in a Kovar (Fe-Ni-Co alloy) lid of a side-brazed dual in-line ceramic package of a microelectronic product. The addition of Pd and a thinner Au flash layers will bring significant cost savings in the manufacturing of this...
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| Format: | Thesis |
| Language: | English |
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