MEMS packaging

The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aeros...

Szczegółowa specyfikacja

Opis bibliograficzny

Kolejni autorzy:	Hsu, Tai-Ran (Redaktor)
Format:	Electronic Resource
Język:	English
Wydane:	London, United Kingdom Institution of Engineering and Technology 2004.
Hasła przedmiotowe:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Dostęp online:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy