MEMS packaging

The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aeros...

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Detalhes bibliográficos

Outros Autores:	Hsu, Tai-Ran (Editor)
Formato:	Electronic Resource
Idioma:	English
Publicado em:	London, United Kingdom Institution of Engineering and Technology 2004.
Assuntos:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Acesso em linha:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy