MEMS packaging

The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aeros...

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Chi tiết về thư mục

Tác giả khác:	Hsu, Tai-Ran (Biên tập viên)
Định dạng:	Electronic Resource
Ngôn ngữ:	English
Được phát hành:	London, United Kingdom Institution of Engineering and Technology 2004.
Những chủ đề:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Truy cập trực tuyến:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy