Heat management in integrated circuits on-chip and system-level monitoring and cooling

The book comprises 6 chapters and covers the following topics: heat in integrated circuits and systems; on-chip temperature sensing; dynamic thermal management; active cooling; mitigating thermal events at the system level and above; and emerging directions in thermal aware systems.

Detalles Bibliográficos
Autor principal:	Ogrenci-Memik, Seda (Autor)
Formato:	Electronic Resource
Lenguaje:	inglés
Publicado:	London, United Kingdom The Institution of Engineering and Technology 2015.
Materias:	Integrated circuits > Design and construction. Electronic circuits > Temperature compensation. Temperature measuring instruments. Temperature control. Chip scale packaging. Electronic books.
Acceso en línea:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy