Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

書誌詳細
第一著者: Tong, Xingcun Colin
団体著者: SpringerLink (Online service)
フォーマット: Electronic Resource
言語:English
出版事項: New York, NY Springer New York 2011.
シリーズ:Springer series in advanced microelectronics 30
主題:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
オンライン･アクセス:Available for University of the Philippines Diliman via SpringerLink. Click here to access