Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Podrobná bibliografie
Hlavní autor: Tong, Xingcun Colin
Korporativní autor: SpringerLink (Online service)
Médium: Electronic Resource
Jazyk:English
Vydáno: New York, NY Springer New York 2011.
Edice:Springer series in advanced microelectronics 30
Témata:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
On-line přístup:Available for University of the Philippines Diliman via SpringerLink. Click here to access