Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Bibliografiset tiedot
Päätekijä: Tong, Xingcun Colin
Yhteisötekijä: SpringerLink (Online service)
Aineistotyyppi: Electronic Resource
Kieli:English
Julkaistu: New York, NY Springer New York 2011.
Sarja:Springer series in advanced microelectronics 30
Aiheet:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Linkit:Available for University of the Philippines Diliman via SpringerLink. Click here to access