Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Detalles Bibliográficos
Autor principal: Tong, Xingcun Colin
Autor Corporativo: SpringerLink (Online service)
Formato: Electronic Resource
Lenguaje:English
Publicado: New York, NY Springer New York 2011.
Colección:Springer series in advanced microelectronics 30
Materias:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Acceso en línea:Available for University of the Philippines Diliman via SpringerLink. Click here to access