Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Bibliografski detalji
Glavni autor: Tong, Xingcun Colin
Autor kompanije: SpringerLink (Online service)
Format: Electronic Resource
Jezik:English
Izdano: New York, NY Springer New York 2011.
Serija:Springer series in advanced microelectronics 30
Teme:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Online pristup:Available for University of the Philippines Diliman via SpringerLink. Click here to access