Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Détails bibliographiques
Auteur principal: Tong, Xingcun Colin
Collectivité auteur: SpringerLink (Online service)
Format: Electronic Resource
Langue:English
Publié: New York, NY Springer New York 2011.
Collection:Springer series in advanced microelectronics 30
Sujets:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Accès en ligne:Available for University of the Philippines Diliman via SpringerLink. Click here to access