Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Библиографические подробности
Главный автор: Tong, Xingcun Colin
Соавтор: SpringerLink (Online service)
Формат: Electronic Resource
Язык:English
Опубликовано: New York, NY Springer New York 2011.
Серии:Springer series in advanced microelectronics 30
Предметы:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Online-ссылка:Available for University of the Philippines Diliman via SpringerLink. Click here to access