Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Manylion Llyfryddiaeth
Prif Awdur: Tong, Xingcun Colin
Awdur Corfforaethol: SpringerLink (Online service)
Fformat: Electronic Resource
Iaith:English
Cyhoeddwyd: New York, NY Springer New York 2011.
Cyfres:Springer series in advanced microelectronics 30
Pynciau:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Mynediad Ar-lein:Available for University of the Philippines Diliman via SpringerLink. Click here to access