Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Xehetasun bibliografikoak
Egile nagusia: Tong, Xingcun Colin
Erakunde egilea: SpringerLink (Online service)
Formatua: Electronic Resource
Hizkuntza:English
Argitaratua: New York, NY Springer New York 2011.
Saila:Springer series in advanced microelectronics 30
Gaiak:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Sarrera elektronikoa:Available for University of the Philippines Diliman via SpringerLink. Click here to access