Advanced materials for thermal management of electronic packaging

Detalhes bibliográficos
Autor principal:	Tong, Xingcun Colin
Autor Corporativo:	SpringerLink (Online service)
Formato:	Electronic Resource
Idioma:	English
Publicado em:	New York, NY Springer New York 2011.
Colecção:	Springer series in advanced microelectronics 30
Assuntos:	Electronic apparatus and appliances > Temperature control. Electronic packaging > Materials. Electronic books.
Acesso em linha:	Available for University of the Philippines Diliman via SpringerLink. Click here to access