Advanced materials for thermal management of electronic packaging
| Prif Awdur: | |
|---|---|
| Awdur Corfforaethol: | |
| Fformat: | Electronic Resource |
| Iaith: | English |
| Cyhoeddwyd: |
New York, NY
Springer New York
2011.
|
| Cyfres: | Springer series in advanced microelectronics
30 |
| Pynciau: | |
| Mynediad Ar-lein: | Available for University of the Philippines Diliman via SpringerLink. Click here to access |


