Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Opis bibliograficzny
1. autor: Tong, Xingcun Colin
Korporacja: SpringerLink (Online service)
Format: Electronic Resource
Język:English
Wydane: New York, NY Springer New York 2011.
Seria:Springer series in advanced microelectronics 30
Hasła przedmiotowe:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Dostęp online:Available for University of the Philippines Diliman via SpringerLink. Click here to access