Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Bibliografische gegevens
Hoofdauteur: Tong, Xingcun Colin
Coauteur: SpringerLink (Online service)
Formaat: Electronic Resource
Taal:English
Gepubliceerd in: New York, NY Springer New York 2011.
Reeks:Springer series in advanced microelectronics 30
Onderwerpen:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Online toegang:Available for University of the Philippines Diliman via SpringerLink. Click here to access