Advanced materials for thermal management of electronic packaging

Advanced materials for thermal management of electronic packaging

Dades bibliogràfiques
Autor principal: Tong, Xingcun Colin
Autor corporatiu: SpringerLink (Online service)
Format: Electronic Resource
Idioma:English
Publicat: New York, NY Springer New York 2011.
Col·lecció:Springer series in advanced microelectronics 30
Matèries:
Electronic apparatus and appliances > Temperature control.
Electronic packaging > Materials.
Electronic books.
Accés en línia:Available for University of the Philippines Diliman via SpringerLink. Click here to access