APA引文

Tong, X. C. (2011). Advanced materials for thermal management of electronic packaging. Springer New York.

Chicago Style (17th ed.) Citation

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. New York, NY: Springer New York, 2011.

MLA引文

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. Springer New York, 2011.