Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits
The mold compound of plastic encapsulated microcircuits (PEMs) is susceptible to moisture sorption which can lead to device failure especially on application specific high stress environment. Some of the moisture-related failure mechanisms for integrated circuit (IC) PEMs include corrosion, hygrosco...
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| Định dạng: | Luận văn |
| Ngôn ngữ: | English |
| Được phát hành: |
Quezon City
College of Engineering, University of the Philippines Diliman
2014.
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| Những chủ đề: |