Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits

The mold compound of plastic encapsulated microcircuits (PEMs) is susceptible to moisture sorption which can lead to device failure especially on application specific high stress environment. Some of the moisture-related failure mechanisms for integrated circuit (IC) PEMs include corrosion, hygrosco...

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Detaylı Bibliyografya
Yazar: Gustilo, Paul Angelo D. (Yazar)
Materyal Türü: Tez
Dil:English
Baskı/Yayın Bilgisi: Quezon City College of Engineering, University of the Philippines Diliman 2014.
Konular: