Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Opis bibliograficzny

Wydane w:	Philippine Engineering Journal 18, 1 (1997(Je)).
1. autor:	De Guzman, Jose Cesar
Kolejni autorzy:	Mena, Manolo G., Epistola, E.
Format:	Artykuł
Język:	English
Hasła przedmiotowe:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
Dostęp online:	Also available online for University of the Philippines Diliman. Click here