Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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出版年:	Philippine Engineering Journal 18, 1 (1997(Je)).
第一著者:	De Guzman, Jose Cesar
その他の著者:	Mena, Manolo G., Epistola, E.
フォーマット:	論文
言語:	English
主題:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
オンライン･アクセス:	Also available online for University of the Philippines Diliman. Click here