Elimination of assembly induced package cracks in plastic SOIC

Considerable amount of information and knowledge is available on moisture induced package cracking, especially on surface mount devices. During IC assembly itself, plastic packages are subject to thermal and mechanical stresses which may lead to package cracking or degrade package strength, thus mak...

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Veröffentlicht in:	Philippine Engineering Journal 18, 1 (1997(Je)).
1. Verfasser:	De Guzman, Jose Cesar
Weitere Verfasser:	Mena, Manolo G., Epistola, E.
Format:	Artikel
Sprache:	English
Schlagworte:	Plastic integrated circuit packaging. Small-outline integrated circuit (SOIC). Surface mount technology.
Online Zugang:	Also available online for University of the Philippines Diliman. Click here